SKU: 48192757373
Ships within 48 hours · Estimated delivery Sep 29 - Oct 4
AI intelligent ice core
AY A108 iPhone X/11/12/13/14/15/16 Pro Max Dot Matrix No-soldering Non-disassembly Face ID Repair Tag-on Cable Solution
Extended 7 USB2
Easy UFS EMMC UFS ISP kit: including encryption chip
Mechanic D65T features:
YCS Mobile BGA Reballing Stencils for iPhone Android Phones CPU Chip Chips & Components AI intelligent ice coreYCS Chip Repair Soldering Stencil is made of imported alloy steel, possessing superior flexibility and high temperature resistance. It ensures precise mesh alignment and long term durability, making it suitable for BGA soldering repair of mobile phone chips, especially for soldering CPUs and GPUs in Apple iPhone 6 17 Pro Max and Android Phone series. Features: 1. High Precision: Each mesh is calibrated according to the original manufacturer's
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