MECHANIC iBGA 13 Reballing Stencil Platform For iPhone 13 Pro Max Mini Option:iBGA 13 for iPhone 13 series The size for capacitive touch

The size for capacitive touch screen is bigger

Remote control: Support remote control operation

Remove dusts

JC 13 In 1 Intel Qualcomm Logic Baseband EEPROM Chip Data Module Chip Non-removal Repair Tool For iPhone X-12 Pro Max eeprom baseband repair

3840x2160@ 30fps MJPEG/ 2592x1944@ 30fps MJPEG

MECHANIC iBGA 13 Reballing Stencil Platform For iPhone 13 Pro Max Mini Option:iBGA 13 for iPhone 13 series The size for capacitive touchMECHANIC iBGA 13 Middle Layer Motherboard Reballing Kit For iPhone 13 mini pro max Template Soldering Platform With Stencil, 4 in 1 BGA Reballing Stencil Platform Motherboard Middle Rework Tin Mesh Template for iPhone 13 13 Pro 13 Pro Max 12 mini. Features: 1. Anti leakage tin barrier design. 2. High temperature does not allow the drum. 3. Strong magnetic automatic positioning, precision positioning. 4. Integrated, removable tin planting. 5.