WDS-700 BGA desoldering Rework Station for circuit boards repair Screen Alignment Mold camera apron etc

camera apron etc

keeps the screen stationary2

erase region mode )

Honor 3X Pro

Focus adjustment stroke: 2-3/8" (50mm)

WDS-700 BGA desoldering Rework Station for circuit boards repair Screen Alignment Mold camera apron etcOptical alignment system BGA rework station WDS 700. WDS 700 BGA Rework Station are widely used to replace and repair the BGA chip in laptop, mobile phone, The main user is repairing shops and factory to provide the after sales service and rework. How to separate BGA chip from motherboard How to replace a new BGA chip Repair steps : Separate the BGA chip from mother board we called desoldering Clean Pad Reballing or replace a new BGA chip directly